There are no models available for this part yet.
Overview of SSTV16859EC,557 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 5 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
CAD Models for SSTV16859EC,557 by NXP Semiconductors
Part Data Attributes for SSTV16859EC,557 by NXP Semiconductors
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LFBGA, BGA96,6X16,32
|
|
Pin Count
|
96
|
|
Manufacturer Package Code
|
SOT536-1
|
|
Reach Compliance Code
|
not_compliant
|
|
HTS Code
|
8542.39.00.01
|
|
Family
|
SSTV
|
|
JESD-30 Code
|
R-PBGA-B96
|
|
JESD-609 Code
|
e0
|
|
Length
|
13.5 mm
|
|
Logic IC Type
|
D FLIP-FLOP
|
|
Number of Bits
|
13
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
96
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Output Polarity
|
TRUE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFBGA
|
|
Package Equivalence Code
|
BGA96,6X16,32
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Propagation Delay (tpd)
|
2.8 ns
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.5 mm
|
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Trigger Type
|
POSITIVE EDGE
|
|
Width
|
5.5 mm
|
|
fmax-Min
|
200 MHz
|
Alternate Parts for SSTV16859EC,557
This table gives cross-reference parts and alternative options found for SSTV16859EC,557. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SSTV16859EC,557, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| SSTV16859EC | IC SSTV SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96, PLASTIC, LFBGA-96, FF/Latch | NXP Semiconductors | SSTV16859EC,557 vs SSTV16859EC |
| SSTV16859EC/G,557 | SSTV16859 - 2.5 V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM BGA 96-Pin | NXP Semiconductors | SSTV16859EC,557 vs SSTV16859EC/G,557 |
| 935271265551 | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96, FF/Latch | NXP Semiconductors | SSTV16859EC,557 vs 935271265551 |
| SSTVF16859EC | IC SSTV SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96, FF/Latch | NXP Semiconductors | SSTV16859EC,557 vs SSTVF16859EC |
| 935271265557 | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96, FF/Latch | NXP Semiconductors | SSTV16859EC,557 vs 935271265557 |