Part Details for SST34HF1601C-70-4E-L1PE by Silicon Storage Technology
Results Overview of SST34HF1601C-70-4E-L1PE by Silicon Storage Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SST34HF1601C-70-4E-L1PE Information
SST34HF1601C-70-4E-L1PE by Silicon Storage Technology is an Other Memory IC.
Other Memory ICs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for SST34HF1601C-70-4E-L1PE
SST34HF1601C-70-4E-L1PE CAD Models
SST34HF1601C-70-4E-L1PE Part Data Attributes
|
SST34HF1601C-70-4E-L1PE
Silicon Storage Technology
Buy Now
Datasheet
|
Compare Parts:
SST34HF1601C-70-4E-L1PE
Silicon Storage Technology
Memory Circuit, 1MX16, CMOS, PBGA56, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56
Select a part to compare: |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SILICON STORAGE TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | LFBGA, | |
Pin Count | 56 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | FLASH CAN ALSO BE ORGANIZED AS 2M X 8 | |
JESD-30 Code | R-PBGA-B56 | |
Length | 10 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 56 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Organization | 1MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.3 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |