Datasheets
SST34HF1601C-70-4E-L1PE by: Silicon Storage Technology

Memory Circuit, 1MX16, CMOS, PBGA56, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56

Part Details for SST34HF1601C-70-4E-L1PE by Silicon Storage Technology

Results Overview of SST34HF1601C-70-4E-L1PE by Silicon Storage Technology

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Computing and Data Storage Renewable Energy Robotics and Drones

SST34HF1601C-70-4E-L1PE Information

SST34HF1601C-70-4E-L1PE by Silicon Storage Technology is an Other Memory IC.
Other Memory ICs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Part Details for SST34HF1601C-70-4E-L1PE

SST34HF1601C-70-4E-L1PE CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

SST34HF1601C-70-4E-L1PE Part Data Attributes

SST34HF1601C-70-4E-L1PE Silicon Storage Technology
Buy Now Datasheet
Compare Parts:
SST34HF1601C-70-4E-L1PE Silicon Storage Technology Memory Circuit, 1MX16, CMOS, PBGA56, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56
Select a part to compare:
Part Life Cycle Code Obsolete
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC
Part Package Code BGA
Package Description LFBGA,
Pin Count 56
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Additional Feature FLASH CAN ALSO BE ORGANIZED AS 2M X 8
JESD-30 Code R-PBGA-B56
Length 10 mm
Memory Density 16777216 bit
Memory IC Type MEMORY CIRCUIT
Memory Width 16
Number of Functions 1
Number of Terminals 56
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Organization 1MX16
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm