Part Details for SST32HF3242-70-4C-LFS by Silicon Storage Technology
Overview of SST32HF3242-70-4C-LFS by Silicon Storage Technology
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for SST32HF3242-70-4C-LFS
SST32HF3242-70-4C-LFS CAD Models
SST32HF3242-70-4C-LFS Part Data Attributes
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SST32HF3242-70-4C-LFS
Silicon Storage Technology
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Datasheet
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SST32HF3242-70-4C-LFS
Silicon Storage Technology
Memory Circuit, 2MX16, CMOS, PBGA63, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-63
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SILICON STORAGE TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | LFBGA, | |
Pin Count | 63 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | SRAM IS ORGANIZED AS 256K X 16 | |
JESD-30 Code | R-PBGA-B63 | |
Length | 10 mm | |
Memory Density | 33554432 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 63 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.3 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 8 mm |