Part Details for SST12LF01-QDE by Microchip Technology Inc
Overview of SST12LF01-QDE by Microchip Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SST12LF01-QDE
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SST12LF01-QDE
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Avnet Silica | Front End Module 24-Pin WQFN EP (Alt: SST12LF01-QDE) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 54 Weeks, 0 Days | Silica - 0 |
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Part Details for SST12LF01-QDE
SST12LF01-QDE CAD Models
SST12LF01-QDE Part Data Attributes
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SST12LF01-QDE
Microchip Technology Inc
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Datasheet
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SST12LF01-QDE
Microchip Technology Inc
SPECIALTY TELECOM CIRCUIT, QCC24, 4 X 4 MM, ROHS COMPLIANT, MO-220JWGGD-4, WQFN-24
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | QFN | |
Package Description | 4 X 4 MM, ROHS COMPLIANT, MO-220JWGGD-4, WQFN-24 | |
Pin Count | 24 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
JESD-30 Code | S-XQCC-N24 | |
JESD-609 Code | e3 | |
Length | 4 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 80 °C | |
Operating Temperature-Min | ||
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 4 mm |