Part Details for SPC5673FF3MVR3 by Freescale Semiconductor
Overview of SPC5673FF3MVR3 by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SPC5673FF3MVR3
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | MPC5674F - MAMBA -NXP 32-bit MCU, Power Arch core, 3MB Flash RoHS: Compliant Status: Active Min Qty: 1 | 155 |
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$57.6400 / $67.8100 | Buy Now |
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Chip1Cloud | IC MCU 32BIT 3MB FLASH 416BGA | 9425 |
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RFQ |
Part Details for SPC5673FF3MVR3
SPC5673FF3MVR3 CAD Models
SPC5673FF3MVR3 Part Data Attributes:
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SPC5673FF3MVR3
Freescale Semiconductor
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Datasheet
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SPC5673FF3MVR3
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch core, 3MB Flash, 264MHz, -40/+125degC, Automotive Grade, PBGA 416
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Bit Size | 32 | |
CPU Family | E200 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e2 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 416 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC | |
Package Code | BGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 196608 | |
ROM (words) | 3145728 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Speed | 264 MHz | |
Supply Current-Max | 1000 mA | |
Surface Mount | YES | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 |