Part Details for SPC5642AF2MVZ3 by NXP Semiconductors
Overview of SPC5642AF2MVZ3 by NXP Semiconductors
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Transportation and Logistics
Healthcare
Automotive
Price & Stock for SPC5642AF2MVZ3
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
13AC3034
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Newark | Nxp 32-Bit Mcu, Power Arch Core, 2Mb Flash, 80Mhz, -40/+105Degc, Automotive Grade, Pbga 324/ Tray Rohs Compliant: Yes |Nxp SPC5642AF2MVZ3 Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$25.4200 / $26.7300 | Buy Now |
|
DISTI #
SPC5642AF2MVZ3-ND
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DigiKey | IC MCU 32BIT 2MB FLASH 324PBGA Min Qty: 60 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$33.6008 | Buy Now |
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DISTI #
SPC5642AF2MVZ3
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Avnet Americas | MCU 32-Bit MPC56xx e200z4 RISC 2048KB Flash 1.2V/3.3V/5V 324-Pin BGA Tray - Trays (Alt: SPC5642AF2MVZ3) RoHS: Compliant Min Qty: 180 Package Multiple: 60 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$23.1756 / $26.7267 | Buy Now |
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DISTI #
841-SPC5642AF2MVZ3
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Mouser Electronics | 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 2MB Flash, 80MHz, -40/+105degC, Automotive Grade, PBGA 324 RoHS: Compliant | 0 |
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$29.7500 / $31.7400 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 180 Package Multiple: 60 Container: Tray | 0Tray |
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$28.7600 | Buy Now |
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DISTI #
SPC5642AF2MVZ3
|
Avnet Americas | MCU 32-Bit MPC56xx e200z4 RISC 2048KB Flash 1.2V/3.3V/5V 324-Pin BGA Tray - Trays (Alt: SPC5642AF2MVZ3) RoHS: Compliant Min Qty: 180 Package Multiple: 60 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$23.1756 / $26.7267 | Buy Now |
|
DISTI #
SPC5642AF2MVZ3
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Avnet Silica | MCU 32-Bit MPC56xx e200z4 RISC 2048KB Flash 1.2V/3.3V/5V 324-Pin BGA Tray (Alt: SPC5642AF2MVZ3) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 2 Weeks, 4 Days | Silica - 0 |
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Buy Now |
Part Details for SPC5642AF2MVZ3
SPC5642AF2MVZ3 CAD Models
SPC5642AF2MVZ3 Part Data Attributes:
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SPC5642AF2MVZ3
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SPC5642AF2MVZ3
NXP Semiconductors
RISC MICROCONTROLLER
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | E200 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e2 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 112 | |
| Number of Terminals | 324 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 131072 | |
| ROM (words) | 2097152 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Speed | 80 MHz | |
| Supply Current-Max | 300 mA | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |