Part Details for SP0610T by Siemens
Results Overview of SP0610T by Siemens
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SP0610T Information
SP0610T by Siemens is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for SP0610T
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | P-CHANNEL ENHANCEMENT IGBT SOT-23 Small Signal Field-Effect Transistor, 0.13A I(D), 60V, 1-Element, ... more ECCN: EAR99 RoHS: Not Compliant |
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Part Details for SP0610T
SP0610T CAD Models
SP0610T Part Data Attributes
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SP0610T
Siemens
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Datasheet
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SP0610T
Siemens
Small Signal Field-Effect Transistor, 0.13A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-236, SOT-23, 3 PIN
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SIEMENS A G | |
| Part Package Code | SOT-23 | |
| Package Description | SOT-23, 3 PIN | |
| Pin Count | 3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 0.13 A | |
| Drain-source On Resistance-Max | 10 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| Feedback Cap-Max (Crss) | 12 pF | |
| JEDEC-95 Code | TO-236 | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e0 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Polarity/Channel Type | P-CHANNEL | |
| Power Dissipation-Max (Abs) | 0.36 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Transistor Element Material | SILICON |
Alternate Parts for SP0610T
This table gives cross-reference parts and alternative options found for SP0610T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SP0610T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SP0610TE6327 | Infineon Technologies AG | Check for Price | Small Signal Field-Effect Transistor, 0.13A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SOT-23, 3 PIN | SP0610T vs SP0610TE6327 |
SP0610T Frequently Asked Questions (FAQ)
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Siemens recommends a 4-layer PCB with a dedicated ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the power traces. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal interface material.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots.
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Siemens recommends a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. A soldering iron temperature of 350°C (662°F) is recommended for hand soldering. It's essential to follow the recommended soldering techniques and profiles to avoid damaging the device.
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To troubleshoot and diagnose issues with the SP0610T, start by checking the input and output voltages, as well as the current consumption. Use an oscilloscope to monitor the voltage and current waveforms. Check for signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
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To minimize EMI and EMC issues, ensure proper PCB layout and routing, including the use of shielding and filtering components. Follow the recommended layout guidelines and consider using a common-mode choke or EMI filter. Additionally, ensure that the device is properly decoupled and that the input and output capacitors are selected to minimize EMI.