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Part Details for SN74SSTUB32866NMJR by Texas Instruments
Overview of SN74SSTUB32866NMJR by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Price & Stock for SN74SSTUB32866NMJR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-SN74SSTUB32866NMJRCT-ND
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DigiKey | IC CONFIG REG BUFF 25BIT 96-BGA Min Qty: 1 Lead time: 6 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) | Temporarily Out of Stock |
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$6.7630 / $11.9200 | Buy Now |
|
DISTI #
595-74SSTUB32866NMJR
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Mouser Electronics | Registers 25-bit configurable registered buffer with address-parity test 96-NFBGA -40 to 85 RoHS: Compliant | 99 |
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$6.7600 / $11.9100 | Buy Now |
Part Details for SN74SSTUB32866NMJR
SN74SSTUB32866NMJR CAD Models
SN74SSTUB32866NMJR Part Data Attributes
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SN74SSTUB32866NMJR
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
SN74SSTUB32866NMJR
Texas Instruments
25-bit configurable registered buffer with address-parity test 96-NFBGA -40 to 85
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | NFBGA-96 | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2020-12-05 | |
| Samacsys Manufacturer | Texas Instruments | |
| Family | SSTU | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 13.5 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Max Frequency@Nom-Sup | 410000000 Hz | |
| Moisture Sensitivity Level | 3 | |
| Number of Bits | 25 | |
| Number of Functions | 1 | |
| Number of Terminals | 96 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA96,6X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supply Current-Max (ICC) | 40 mA | |
| Prop. Delay@Nom-Sup | 0.8 ns | |
| Propagation Delay (tpd) | 0.8 ns | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | TTL | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Trigger Type | POSITIVE EDGE | |
| Width | 5.5 mm | |
| fmax-Min | 410 MHz |