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Part Details for SN65LVCP114ZJA by Texas Instruments
Overview of SN65LVCP114ZJA by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Audio and Video Systems
Telecommunications
Entertainment and Gaming
Price & Stock for SN65LVCP114ZJA
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-SN65LVCP114ZJA-ND
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DigiKey | IC MULTIPLEXER 4CH 167NFBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
1098 In Stock |
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$24.1262 / $32.1100 | Buy Now |
|
DISTI #
595-SN65LVCP114ZJA
|
Mouser Electronics | LVDS Interface IC 14.2Gbps Quad Mux Linear-Redriver RoHS: Compliant | 160 |
|
$24.1200 / $32.1000 | Buy Now |
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|
Ameya Holding Limited | 16714.2G QUAD 1:2-2:1 MUX-REDRIVER | 3078 |
|
RFQ |
Part Details for SN65LVCP114ZJA
SN65LVCP114ZJA CAD Models
SN65LVCP114ZJA Part Data Attributes:
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SN65LVCP114ZJA
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
SN65LVCP114ZJA
Texas Instruments
14.2-Gbps quad mux, linear-redriver with signal conditioning 167-NFBGA -40 to 85
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | BGA-167 | |
| Pin Count | 167 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Data Rate | 14200000 Mbps | |
| JESD-30 Code | S-PBGA-B167 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Channels | 8 | |
| Number of Functions | 4 | |
| Number of Terminals | 167 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA167,14X14,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.35 mm | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm |