Part Details for SLG88104V by Dialog Semiconductor GmbH
Results Overview of SLG88104V by Dialog Semiconductor GmbH
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
SLG88104V Information
SLG88104V by Dialog Semiconductor GmbH is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Part Details for SLG88104V
SLG88104V CAD Models
SLG88104V Part Data Attributes
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SLG88104V
Dialog Semiconductor GmbH
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SLG88104V
Dialog Semiconductor GmbH
Operational Amplifier,
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | DIALOG SEMICONDUCTOR GMBH | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Amplifier Type | OPERATIONAL AMPLIFIER |
Alternate Parts for SLG88104V
This table gives cross-reference parts and alternative options found for SLG88104V. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SLG88104V, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SLG88104V | Renesas Electronics Corporation | Check for Price | Micropower Operational Amplifier for GreenPAK™, STQFN, 5000/Tape & Reel | SLG88104V vs SLG88104V |
SLG88104V Frequently Asked Questions (FAQ)
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A good thermal design is crucial for the SLG88104V. It's recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the IC to dissipate heat efficiently. Additionally, keep the PCB traces as short and wide as possible to reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and thermal design guidelines. Also, consider using a heat sink or a thermal interface material (TIM) to improve heat dissipation. Make sure to derate the device's power consumption according to the ambient temperature.
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To minimize EMI and ESD issues, use a multi-layer PCB with a solid ground plane, and place EMI filters and TVS diodes near the SLG88104V. Ensure that the PCB layout follows good EMI design practices, such as keeping sensitive signals away from noisy ones and using shielded cables. Also, follow the recommended ESD protection guidelines for handling and assembly.
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To optimize the SLG88104V for low-power consumption, use the lowest possible input voltage, enable the power-saving features, and adjust the switching frequency according to your application's requirements. Additionally, consider using a low-power mode or shutdown mode when the device is not in use.
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For debugging and validation, it's recommended to use a high-speed oscilloscope, a logic analyzer, and a power analyzer. These tools will help you measure the device's performance, identify issues, and optimize the design. Additionally, consider using a temperature measurement tool to monitor the device's temperature during operation.