Datasheets
SLA560BC4T3F by: ROHM Semiconductor

Single Color LED, Blue, Colorless Transparent, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2

Part Details for SLA560BC4T3F by ROHM Semiconductor

Results Overview of SLA560BC4T3F by ROHM Semiconductor

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

SLA560BC4T3F Information

SLA560BC4T3F by ROHM Semiconductor is a Visible LED.
Visible LEDs are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Part Details for SLA560BC4T3F

SLA560BC4T3F CAD Models

SLA560BC4T3F Part Data Attributes

SLA560BC4T3F ROHM Semiconductor
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SLA560BC4T3F ROHM Semiconductor Single Color LED, Blue, Colorless Transparent, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ROHM CO LTD
Package Description ROHS COMPLIANT PACKAGE-2
Reach Compliance Code compliant
HTS Code 8541.40.20.00
Samacsys Manufacturer ROHM Semiconductor
Color BLUE
Color@Wavelength Blue
Configuration SINGLE
Forward Current-Max 0.03 A
JESD-609 Code e1
Lens Type COLORLESS TRANSPARENT
Luminous Intensity-Nom 470.0 mcd
Mounting Feature RADIAL MOUNT
Number of Functions 1
Number of Terminals 2
Operating Temperature-Max 80 °C
Operating Temperature-Min -20 °C
Optoelectronic Device Type SINGLE COLOR LED
Overall Height 8.5 mm
Packing Method BULK
Peak Wavelength 468 nm
Reverse Voltage-Max 5 V
Shape ROUND
Size 5 mm
Surface Mount NO
T-code T-1 3/4
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch 2.5 mm
Viewing Angle 40 deg

SLA560BC4T3F Related Parts

SLA560BC4T3F Frequently Asked Questions (FAQ)

  • ROHM recommends a thermal pad size of at least 2mm x 2mm, with multiple vias connecting to a solid ground plane to ensure efficient heat dissipation. A minimum of 1oz copper thickness is also recommended.

  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.

  • ROHM recommends soldering the SLA560BC4T3F using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds. Hand soldering is not recommended due to the device's small size and high pin count.

  • While the SLA560BC4T3F is designed to be robust, it's still important to follow proper mounting and soldering techniques to ensure reliable operation in high-vibration environments. Consider using a vibration-dampening material or a rigid PCB to minimize the risk of mechanical stress.

  • To troubleshoot issues with the output voltage regulation, check the input voltage, output load, and feedback resistors for any errors or misconfigurations. Verify that the device is properly soldered and that there are no signs of overheating or physical damage.