Part Details for SL3S1215FUD/HAZ by NXP Semiconductors
Results Overview of SL3S1215FUD/HAZ by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Price & Stock for SL3S1215FUD/HAZ
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
95AC2193
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Newark | Sl3S1215Fud/Ha/ Ffc Rohs Compliant: Yes |Nxp SL3S1215FUD/HAZ RoHS: Compliant Min Qty: 135958 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$0.0260 | Buy Now |
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DISTI #
SL3S1215FUD/HAZ
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Avnet Silica | UCODE 8m RFID Tag IC Wafer EPCglobal v201 (Alt: SL3S1215FUD/HAZ) RoHS: Compliant Min Qty: 135958 Package Multiple: 135958 | Silica - 0 |
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Buy Now |
Part Details for SL3S1215FUD/HAZ
SL3S1215FUD/HAZ CAD Models
SL3S1215FUD/HAZ Part Data Attributes
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SL3S1215FUD/HAZ
NXP Semiconductors
Buy Now
Datasheet
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SL3S1215FUD/HAZ
NXP Semiconductors
Consumer Circuit
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.32.00 | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
SL3S1215FUD/HAZ Frequently Asked Questions (FAQ)
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A good PCB layout for the SL3S1215FUD/HAZ involves keeping the antenna area clear of copper, using a solid ground plane, and minimizing the length of the RF traces. It's also recommended to follow the layout guidelines provided in the NXP application note AN11773.
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To ensure the SL3S1215FUD/HAZ operates within the specified temperature range, it's essential to provide adequate heat dissipation, avoid overheating, and follow the recommended operating conditions. Additionally, consider using thermal interface materials and heat sinks if necessary.
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The SL3S1215FUD/HAZ is designed to operate in a wide range of temperatures and humidity levels. However, extreme conditions can affect its performance and reliability. In humid or high-temperature environments, consider using conformal coating, sealing, or potting to protect the device. Also, ensure the device is properly soldered and the PCB is designed to minimize moisture ingress.
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To troubleshoot issues with the SL3S1215FUD/HAZ, start by verifying the device is properly soldered and the PCB layout is correct. Check the power supply, clock, and reset signals. Use a logic analyzer or oscilloscope to debug the communication protocol. Also, consult the NXP documentation and application notes for troubleshooting guidelines and FAQs.
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When using the SL3S1215FUD/HAZ in a secure application, consider implementing secure boot mechanisms, encrypting data, and using secure communication protocols. Also, ensure the device is configured to use secure modes, such as secure firmware updates and secure key storage. Consult the NXP documentation and security guidelines for more information.