Part Details for SL3S1013FTB0 by NXP Semiconductors
Overview of SL3S1013FTB0 by NXP Semiconductors
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- CAD Models: (Request Part)
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- Part Data Attributes: (Available)
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Part Details for SL3S1013FTB0
SL3S1013FTB0 CAD Models
SL3S1013FTB0 Part Data Attributes
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SL3S1013FTB0
NXP Semiconductors
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Datasheet
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SL3S1013FTB0
NXP Semiconductors
SPECIALTY TELECOM CIRCUIT, PDSO6, 1.45 X 1 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT886F1, XSON-6
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | XSON-6 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.32.00 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PDSO-N6 | |
| Length | 1.45 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.5 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Pure Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 1 mm |