Part Details for SI5330F-B00214-GMR by Silicon Laboratories Inc
Overview of SI5330F-B00214-GMR by Silicon Laboratories Inc
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Applications
Industrial Automation
Financial Technology (Fintech)
Part Details for SI5330F-B00214-GMR
SI5330F-B00214-GMR CAD Models
SI5330F-B00214-GMR Part Data Attributes
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SI5330F-B00214-GMR
Silicon Laboratories Inc
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Datasheet
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SI5330F-B00214-GMR
Silicon Laboratories Inc
Low Skew Clock Driver, 5330 Series, 8 True Output(s), 0 Inverted Output(s), 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-8, QFN-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SILICON LABORATORIES INC | |
| Part Package Code | QFN | |
| Package Description | 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Family | 5330 | |
| Input Conditioning | STANDARD | |
| JESD-30 Code | S-XQCC-N24 | |
| JESD-609 Code | e4 | |
| Length | 4 mm | |
| Logic IC Type | LOW SKEW CLOCK DRIVER | |
| Number of Functions | 1 | |
| Number of Inverted Outputs | ||
| Number of Terminals | 24 | |
| Number of True Outputs | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC24,.16SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 4 ns | |
| Same Edge Skew-Max (tskwd) | 0.1 ns | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 3.63 V | |
| Supply Voltage-Min (Vsup) | 2.97 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 4 mm | |
| fmax-Min | 200 MHz |