Part Details for SI3233-X-GM by Silicon Laboratories Inc
Overview of SI3233-X-GM by Silicon Laboratories Inc
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for SI3233-X-GM
SI3233-X-GM CAD Models
SI3233-X-GM Part Data Attributes
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SI3233-X-GM
Silicon Laboratories Inc
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Datasheet
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SI3233-X-GM
Silicon Laboratories Inc
SLIC, CMOS, ROHS COMPLIANT, MO-220-VHKD-1, QFN-38
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SILICON LABORATORIES INC | |
Part Package Code | QFN | |
Package Description | HVQCCN, | |
Pin Count | 38 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-XQCC-N38 | |
Length | 7 mm | |
Number of Functions | 1 | |
Number of Terminals | 38 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.95 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | SLIC | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 5 mm |