Datasheets
SI3233-X-GM by: Silicon Laboratories Inc

SLIC, CMOS, ROHS COMPLIANT, MO-220-VHKD-1, QFN-38

Part Details for SI3233-X-GM by Silicon Laboratories Inc

Overview of SI3233-X-GM by Silicon Laboratories Inc

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for SI3233-X-GM

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SI3233-X-GM Part Data Attributes

SI3233-X-GM Silicon Laboratories Inc
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SI3233-X-GM Silicon Laboratories Inc SLIC, CMOS, ROHS COMPLIANT, MO-220-VHKD-1, QFN-38
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SILICON LABORATORIES INC
Part Package Code QFN
Package Description HVQCCN,
Pin Count 38
Reach Compliance Code unknown
HTS Code 8542.39.00.01
JESD-30 Code S-XQCC-N38
Length 7 mm
Number of Functions 1
Number of Terminals 38
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.95 mm
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Telecom IC Type SLIC
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 5 mm

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