Part Details for SI32171-C-FM1R by Silicon Laboratories Inc
Results Overview of SI32171-C-FM1R by Silicon Laboratories Inc
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- Part Data Attributes: (Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Smart Cities
Electronic Manufacturing
SI32171-C-FM1R Information
SI32171-C-FM1R by Silicon Laboratories Inc is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for SI32171-C-FM1R
SI32171-C-FM1R CAD Models
SI32171-C-FM1R Part Data Attributes
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SI32171-C-FM1R
Silicon Laboratories Inc
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Datasheet
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SI32171-C-FM1R
Silicon Laboratories Inc
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SILICON LABORATORIES INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2020-02-06 |
SI32171-C-FM1R Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common mode filter to reduce EMI.
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Use a high-quality, low-ESR capacitor (e.g., 10uF) for power decoupling, and place it as close to the device as possible. Ensure the power supply is clean and regulated, with minimal noise and ripple.
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A high-quality, low-jitter clock source (e.g., a crystal oscillator) is recommended. The clock frequency should be within the specified range (e.g., 25MHz) and have a duty cycle of 50% ± 5%.
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Consult the Silicon Laboratories application notes and evaluation boards for guidance on configuring the device for specific applications, such as audio or industrial control systems.
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The device has a maximum junction temperature of 150°C. Ensure good airflow and thermal conduction to prevent overheating. Use a thermal pad or heat sink if necessary.