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Capacitors / Aluminum Electrolytic Capacitors / SH200M0022A5S-1015
Datasheets
SH200M0022A5S-1015 by: YAGEO Corporation

Aluminum Electrolytic Capacitor, Polarized, Aluminum (wet), 200V, 20% +Tol, 20% -Tol, 22uF, Through Hole Mount, RADIAL LEADED

Part Details for SH200M0022A5S-1015 by YAGEO Corporation

Results Overview of SH200M0022A5S-1015 by YAGEO Corporation

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Applications Space Technology Aerospace and Defense Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

SH200M0022A5S-1015 Information

SH200M0022A5S-1015 by YAGEO Corporation is an Aluminum Electrolytic Capacitor.
Aluminum Electrolytic Capacitors are under the broader part category of Capacitors.

A capacitor is a passive electronic component that stores energy. Capacitors are commonly used for energy storage, voltage suppression, and signal filtering. Read more about Capacitors on our Capacitors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
TN28F010-150-G Rochester Electronics LLC 28F010 - 128K X 8 Flash
AM27C010-150DI Rochester Electronics LLC AM27C010 - CMOS EPROM 1 Megabit (128K x 8)

Price & Stock for SH200M0022A5S-1015

Part # Distributor Description Stock Price Buy
DISTI # SH200M0022A5S-1015
Avnet Americas Aluminum Electrolytic Capacitor, 22 uF, 200 V, ? 20%, 2000 hours @ 105?C, Radial Leaded - Ammo Pack ... (Alt: SH200M0022A5S-1015) more RoHS: Compliant Min Qty: 10500 Package Multiple: 700 Container: Ammo Pack 0
RFQ
DISTI # SH200M0022A5S-1015
Avnet Abacus Aluminum Electrolytic Capacitor 22 uF 200 V 20 2000 hours 105C Radial Leaded (Alt: SH200M0022A5S-1... 015) more RoHS: Compliant Min Qty: 700 Package Multiple: 700 Abacus - 0
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Part Details for SH200M0022A5S-1015

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SH200M0022A5S-1015 Part Data Attributes

Parametric Data
SH200M0022A5S-1015 YAGEO Corporation
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SH200M0022A5S-1015 YAGEO Corporation Aluminum Electrolytic Capacitor, Polarized, Aluminum (wet), 200V, 20% +Tol, 20% -Tol, 22uF, Through Hole Mount, RADIAL LEADED
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer YAGEO CORP
Package Description ,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8532.22.00.20
Capacitance 22 µF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Diameter 10 mm
Dielectric Material ALUMINUM (WET)
ESR 140 mΩ
Leakage Current 0.142 mA
Length 15 mm
Mounting Feature THROUGH HOLE MOUNT
Negative Tolerance 20%
Number of Terminals 2
Operating Temperature-Max 105 °C
Operating Temperature-Min -25 °C
Package Shape CYLINDRICAL PACKAGE
Package Style Radial
Packing Method AMMO PACK
Polarity POLARIZED
Positive Tolerance 20%
Rated (DC) Voltage (URdc) 200 V
Ripple Current 140 mA
Surface Mount NO
Tan Delta 0.15
Terminal Finish PURE MATTE TIN
Terminal Pitch 5 mm
Terminal Shape WIRE

SH200M0022A5S-1015 Frequently Asked Questions (FAQ)

  • The recommended land pattern for SH200M0022A5S-1015 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.

  • While SH200M0022A5S-1015 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.

  • SH200M0022A5S-1015 is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering.

  • The recommended soldering profile for SH200M0022A5S-1015 is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp-up rate of 3°C/second. This ensures proper soldering and minimizes the risk of component damage.

  • While SH200M0022A5S-1015 is designed for high-frequency applications, it's essential to consider the power density and thermal management in your design. Ensure that the component is properly cooled, and the PCB design takes into account thermal dissipation to prevent overheating and component failure.