Part Details for SFH756 by Broadcom Limited
Results Overview of SFH756 by Broadcom Limited
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Industrial Automation
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
SFH756 Information
SFH756 by Broadcom Limited is a Fiber Optic Transmitter.
Fiber Optic Transmitters are under the broader part category of Fiber Optics.
Fiber optics are thin glass strands used to transmit light signals over long distances, enabling high-speed data transfer. There are two main types—single mode and multimode fibers. Read more about Fiber Optics on our Fiber Optics part category page.
Price & Stock for SFH756
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BCM56524B0KFSBLG
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EBV Elektronik | (Alt: BCM56524B0KFSBLG) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 17 Weeks, 0 Days | EBV - 74400 |
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Part Details for SFH756
SFH756 CAD Models
SFH756 Part Data Attributes
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SFH756
Broadcom Limited
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Datasheet
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Compare Parts:
SFH756
Broadcom Limited
Transmitter, 10Mbps, Through Hole Mount, PLASTIC PACKAGE-2
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | BROADCOM INC | |
| Package Description | PLASTIC PACKAGE-2 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Body Height | 9 mm | |
| Body Length or Diameter | 5.5 mm | |
| Data Rate | 10 Mbps | |
| Emitter/Detector Type | LED | |
| Fiber Optic Device Type | TRANSMITTER | |
| Fiber Type | POF | |
| Mounting Feature | THROUGH HOLE MOUNT | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Operating Wavelength-Nom | 660 nm | |
| Optical Power Output-Nom | 0.2 mW | |
| Supply Voltage-Nom | 2.1 V | |
| Surface Mount | NO | |
| Transmission Type | DIGITAL |
SFH756 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
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Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the SFH756 and the heat sink to minimize thermal resistance.
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Critical timing parameters include clock frequency, clock-to-output delay, and output rise/fall times. Ensure these parameters are met by using a high-quality clock source, minimizing clock distribution network impedance, and using a low-skew clock buffer.
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Use the SFH756's power-down mode, reduce the clock frequency, and minimize the output load capacitance to reduce power consumption. Additionally, consider using a low-power clock source and optimizing the PCB layout for minimal power loss.
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Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure the PCB layout provides a clear path for ESD discharge to ground, and consider using a shielded enclosure to minimize ESD exposure.