Part Details for SDASN8Y-256G-1122 by Western Digital Corp
Results Overview of SDASN8Y-256G-1122 by Western Digital Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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SDASN8Y-256G-1122 Information
SDASN8Y-256G-1122 by Western Digital Corp is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
SER2011-122MLB | Coilcraft Inc | General Purpose Inductor, 1.2uH, 20%, 1 Element, Ferrite-Core, SMD, 7674, ROHS COMPLIANT | |
SER2011-122MLD | Coilcraft Inc | General Purpose Inductor, 1.2uH, 20%, 1 Element, Ferrite-Core, SMD, 7674, ROHS COMPLIANT | |
SER2011-122 | Coilcraft Inc | Power inductor, high current, 10% tol, SMT, RoHS |
Price & Stock for SDASN8Y-256G-1122
Part # | Distributor | Description | Stock | Price | Buy | |
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NAC | 256GB PC SA530 M.2 2280 CLIENT RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for SDASN8Y-256G-1122
SDASN8Y-256G-1122 CAD Models
SDASN8Y-256G-1122 Part Data Attributes
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SDASN8Y-256G-1122
Western Digital Corp
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Datasheet
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SDASN8Y-256G-1122
Western Digital Corp
Flash Card, 256GX8,
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WESTERN DIGITAL CORP | |
Package Description | DIE | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
JESD-30 Code | R-XUUC-N | |
Memory Density | 2199023255552 bit | |
Memory IC Type | FLASH CARD | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Words | 274877906944 words | |
Number of Words Code | 256000000000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256GX8 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER |