Part Details for SCIMX6Q5EYM10CC by Freescale Semiconductor
Overview of SCIMX6Q5EYM10CC by Freescale Semiconductor
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Part Details for SCIMX6Q5EYM10CC
SCIMX6Q5EYM10CC CAD Models
SCIMX6Q5EYM10CC Part Data Attributes
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SCIMX6Q5EYM10CC
Freescale Semiconductor
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Datasheet
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SCIMX6Q5EYM10CC
Freescale Semiconductor
MICROPROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | 21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034, FCBGA-624 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A002.A | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 16 | |
| Bit Size | 64 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 24 MHz | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B624 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 624 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1.5 V | |
| Supply Voltage-Min | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |