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Microcontrollers and Processors / Serial IO/Communication Controllers / SCC2681AC1N40,112
Datasheets
SCC2681AC1N40,112 by: NXP Semiconductors

SCC2681 - Dual asynchronous receiver/transmitter (DUART) DIP 40-Pin

Part Details for SCC2681AC1N40,112 by NXP Semiconductors

Results Overview of SCC2681AC1N40,112 by NXP Semiconductors

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SCC2681AC1N40,112 Information

SCC2681AC1N40,112 by NXP Semiconductors is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for SCC2681AC1N40,112

Part # Distributor Description Stock Price Buy
DISTI # 70R8781
Newark Dual Uart, Fifo, 1Mbps, 5.5V, Dip-40, Uart Ic Type:Serial Uart, No. Of Channels:2Channels, Data R... ate:1Mbps, Supply Voltage Min:4.5V, Supply Voltage Max:5.5V, Ic Case/Package:Dip, No. Of Pins:40Pins, Operating Temperature Min:0°C Rohs Compliant: Yes |Nxp SCC2681AC1N40,112 more RoHS: Compliant Min Qty: 216 Package Multiple: 1 Date Code: 0 Container: Bulk 0
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Vyrian Peripheral ICs 1147
RFQ

Part Details for SCC2681AC1N40,112

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SCC2681AC1N40,112 Part Data Attributes

Parametric Data
SCC2681AC1N40,112 NXP Semiconductors
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SCC2681AC1N40,112 NXP Semiconductors SCC2681 - Dual asynchronous receiver/transmitter (DUART) DIP 40-Pin
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DIP
Package Description 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40
Pin Count 40
Manufacturer Package Code SOT129-1
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Address Bus Width 4
Boundary Scan NO
Clock Frequency-Max 4 MHz
Communication Protocol ASYNC, BIT
Data Encoding/Decoding Method NRZ
Data Transfer Rate-Max 0.125 MBps
External Data Bus Width 8
JESD-30 Code R-PDIP-T40
JESD-609 Code e3
Length 52 mm
Low Power Mode NO
Number of Serial I/Os 2
Number of Terminals 40
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 4.7 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin (Sn)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Alternate Parts for SCC2681AC1N40,112

This table gives cross-reference parts and alternative options found for SCC2681AC1N40,112. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SCC2681AC1N40,112, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
SCC2681AE1N40,112 NXP Semiconductors Check for Price SCC2681 - Dual asynchronous receiver/transmitter (DUART) DIP 40-Pin SCC2681AC1N40,112 vs SCC2681AE1N40,112
Part Number Manufacturer Composite Price Description Compare
SCC2681AC1N40 NXP Semiconductors Check for Price IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP40, 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40, Serial IO/Communication Controller SCC2681AC1N40,112 vs SCC2681AC1N40
SCC2681AE1N40 NXP Semiconductors Check for Price IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP40, 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40, Serial IO/Communication Controller SCC2681AC1N40,112 vs SCC2681AE1N40

SCC2681AC1N40,112 Related Parts

SCC2681AC1N40,112 Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.

  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Ensure the device is operated within the specified junction temperature (Tj) range.

  • Use a multi-layer PCB with a solid ground plane, decouple power supplies, and use EMI filters or chokes on input/output lines. Ensure proper shielding and grounding of the device and surrounding components.

  • Implement power-saving modes, reduce clock frequencies, and optimize the device's voltage regulator. Consider using low-power modes, such as sleep or standby, when the device is not in use.

  • Perform environmental stress testing (EST), including temperature cycling, humidity, and vibration tests. Validate the device's performance using a combination of simulation, emulation, and physical prototyping.