Part Details for SC511660MZP40 by NXP Semiconductors
Overview of SC511660MZP40 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SC511660MZP40
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
78M5329
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Newark | Nxp 32-Bit Mcu, Power Arch , 448Kb Flash, 40Mhz, -40/+125Degc, Automotive Grade, Pbga 272/ Tray Rohs Compliant: Yes |Nxp SC511660MZP40 RoHS: Compliant Min Qty: 200 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$113.0700 | Buy Now |
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DISTI #
SC511660MZP40-ND
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DigiKey | IC MCU 32BIT 448KB FLASH 272PBGA Min Qty: 200 Lead time: 52 Weeks Container: Tray | Limited Supply - Call |
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$110.4125 | Buy Now |
Part Details for SC511660MZP40
SC511660MZP40 CAD Models
SC511660MZP40 Part Data Attributes
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SC511660MZP40
NXP Semiconductors
Buy Now
Datasheet
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SC511660MZP40
NXP Semiconductors
RISC Microcontroller, 32-Bit, FLASH, MPC500 CPU, 40MHz, HCMOS, PBGA272
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| Rohs Code | No | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA-272 | |
| Reach Compliance Code | unknown | |
| Has ADC | YES | |
| Additional Feature | IT ALSO OPERATES AT 5 V | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | MPC500 | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B272 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of External Interrupts | 8 | |
| Number of I/O Lines | 101 | |
| Number of Serial I/Os | 4 | |
| Number of Terminals | 272 | |
| Number of Timers | 3 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA272,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 235 | |
| RAM (bytes) | 26624 | |
| ROM (words) | 458752 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 2.65 mm | |
| Speed | 40 MHz | |
| Supply Current-Max | 250 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | HCMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |