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Part Details for SC18IS600IBS,128 by NXP Semiconductors
Overview of SC18IS600IBS,128 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
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- Part Data Attributes: (Available)
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Part Details for SC18IS600IBS,128
SC18IS600IBS,128 CAD Models
SC18IS600IBS,128 Part Data Attributes
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SC18IS600IBS,128
NXP Semiconductors
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SC18IS600IBS,128
NXP Semiconductors
SC18IS600 - SPI to I²C-bus interface QFN 24-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | HVQFN-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | SOT616-3 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | ||
| Clock Frequency-Max | 18 MHz | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N24 | |
| JESD-609 Code | e4 | |
| Length | 4 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | TSSOP16,.25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 16 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.4 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, I2C |