Datasheets
SC16C850IET,157 by: NXP Semiconductors

SC16C850 - 2.5 V to 3.3 V UART, 16 mode or 68 mode parallel bus interface BGA 36-Pin

Part Details for SC16C850IET,157 by NXP Semiconductors

Results Overview of SC16C850IET,157 by NXP Semiconductors

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SC16C850IET,157 Information

SC16C850IET,157 by NXP Semiconductors is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for SC16C850IET,157

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SC16C850IET,157 Part Data Attributes

SC16C850IET,157 NXP Semiconductors
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SC16C850IET,157 NXP Semiconductors SC16C850 - 2.5 V to 3.3 V UART, 16 mode or 68 mode parallel bus interface BGA 36-Pin
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 3.50 X 3.50 MM, 0.80 MM HEIGHT, ROHS COMPLIANT PLASTIC, SOT912-1, TFBGA-36
Pin Count 36
Manufacturer Package Code SOT912-1
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Additional Feature CAN ALSO OPERATE AT 2.5V SUPPLY
Address Bus Width 3
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT; ETHERNET
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
JESD-30 Code S-PBGA-B36
JESD-609 Code e1
Length 3.5 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Serial I/Os 1
Number of Terminals 36
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA36,6X6,20
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.15 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 3.5 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Alternate Parts for SC16C850IET,157

This table gives cross-reference parts and alternative options found for SC16C850IET,157. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SC16C850IET,157, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
SC16C850IET NXP Semiconductors Check for Price IC 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PBGA36, 3.50 X 3.50 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT912-1, TFBGA-36, Serial IO/Communication Controller SC16C850IET,157 vs SC16C850IET