Part Details for SAK-XC2387-72F66L by Infineon Technologies AG
Overview of SAK-XC2387-72F66L by Infineon Technologies AG
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for SAK-XC2387-72F66L
SAK-XC2387-72F66L CAD Models
SAK-XC2387-72F66L Part Data Attributes:
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SAK-XC2387-72F66L
Infineon Technologies AG
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SAK-XC2387-72F66L
Infineon Technologies AG
RISC Microcontroller, 32-Bit, FLASH, 66MHz, CMOS, PQFP144, GREEN, PLASTIC, LQFP-144
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | QFP | |
| Package Description | GREEN, PLASTIC, LQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 16 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G144 | |
| Length | 20 mm | |
| Number of I/O Lines | 115 | |
| Number of Terminals | 144 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| ROM (words) | 589824 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 4.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |