Part Details for S912XEG384F0CALR by NXP Semiconductors
Overview of S912XEG384F0CALR by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S912XEG384F0CALR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
01AC9935
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Newark | 16-Bit Mcu, S12X Core, 384Kb Flash, 50Mhz, -40/+85Degc, Automotive Qualified, Qfp 112/ Reel Rohs Compliant: Yes |Nxp S912XEG384F0CALR RoHS: Compliant Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$11.7900 / $12.7800 | Buy Now |
DISTI #
S912XEG384F0CALR-ND
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DigiKey | IC MCU 16BIT 384KB FLASH 112LQFP Min Qty: 500 Lead time: 45 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$13.6153 | Buy Now |
DISTI #
S912XEG384F0CALR
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Avnet Americas | S912XEG384F0CAL/LQFP112/REEL 1 - Tape and Reel (Alt: S912XEG384F0CALR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Container: Reel | 0 |
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RFQ |
Part Details for S912XEG384F0CALR
S912XEG384F0CALR CAD Models
S912XEG384F0CALR Part Data Attributes
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S912XEG384F0CALR
NXP Semiconductors
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Datasheet
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S912XEG384F0CALR
NXP Semiconductors
S912XEG384F0CALR
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
CPU Family | CPU12 | |
Clock Frequency-Max | 40 MHz | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G112 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 91 | |
Number of Terminals | 112 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP112,.87SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 24576 | |
ROM (words) | 393216 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Speed | 50 MHz | |
Supply Current-Max | 100 mA | |
Supply Voltage-Max | 1.98 V | |
Supply Voltage-Min | 1.72 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |