Part Details for S71KL512SC0BHB000 by Infineon Technologies AG
Overview of S71KL512SC0BHB000 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S71KL512SC0BHB000
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S71KL512SC0BHB000-ND
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DigiKey | IC FLASH RAM 512MBIT PAR 24FBGA Min Qty: 3380 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$14.0080 | Buy Now |
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DISTI #
727-S71KL512SC0BHB00
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Mouser Electronics | Multichip Packages Nor RoHS: Compliant | 0 |
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$13.6000 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 3380 Package Multiple: 3380 Lead time: 8 Weeks | 0 |
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$13.9500 | Buy Now |
Part Details for S71KL512SC0BHB000
S71KL512SC0BHB000 CAD Models
S71KL512SC0BHB000 Part Data Attributes
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S71KL512SC0BHB000
Infineon Technologies AG
Buy Now
Datasheet
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S71KL512SC0BHB000
Infineon Technologies AG
Memory Circuit, 64MX8, CMOS, PBGA24, FBGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-24 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | HYPER RAM IS ORGANISED AS 8MX8 | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |