Part Details for S70FL01GSAGMFB013 by Cypress Semiconductor
Results Overview of S70FL01GSAGMFB013 by Cypress Semiconductor
- Distributor Offerings: (1 listing)
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S70FL01GSAGMFB013 Information
S70FL01GSAGMFB013 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S70FL01GSAGMFB013
Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 5055 |
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Part Details for S70FL01GSAGMFB013
S70FL01GSAGMFB013 CAD Models
S70FL01GSAGMFB013 Part Data Attributes
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S70FL01GSAGMFB013
Cypress Semiconductor
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Datasheet
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S70FL01GSAGMFB013
Cypress Semiconductor
Flash, 128MX8, PDSO16, SOIC-16
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Package Description | SOIC-16 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.71 | |
Date Of Intro | 2016-12-02 | |
Alternate Memory Width | 1 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e3 | |
Length | 10.3 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP16,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 2.65 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.0006 A | |
Supply Current-Max | 0.2 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Type | NOR TYPE | |
Width | 7.5 mm | |
Write Protection | HARDWARE/SOFTWARE |
S70FL01GSAGMFB013 Frequently Asked Questions (FAQ)
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The recommended operating temperature range for the S70FL01GSAGMFB013 is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 125°C.
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To ensure proper power-up, it's recommended to follow a specific sequence: 1) Apply VCCQ (1.8V) first, 2) Apply VCC (3.3V) after VCCQ is stable, and 3) Apply clock signals after both VCCQ and VCC are stable. This sequence helps prevent latch-up and ensures reliable operation.
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The S70FL01GSAGMFB013 supports clock frequencies up to 166 MHz. However, it's essential to note that the maximum frequency may vary depending on the specific application, PCB design, and signal integrity. It's recommended to consult the datasheet and application notes for more information.
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The S70FL01GSAGMFB013 is a flexible flash memory device that can be configured to support different densities. To configure the device, you need to set the appropriate values for the density select pins (DS0-DS2) during power-up. Refer to the datasheet and application notes for specific configuration details.
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The recommended termination resistors for the S70FL01GSAGMFB013 depend on the specific application and signal integrity requirements. However, as a general guideline, Cypress recommends using 22-ohm to 33-ohm resistors for signal termination. It's essential to consult the datasheet and application notes for more information.