There are no models available for this part yet.
Overview of S34MS04G100BHI000 by Spansion
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S34MS04G100BHI000 by Spansion
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Bristol Electronics | Min Qty: 1 | 605 |
|
$4.5281 / $7.8750 | Buy Now | ||
Quest Components | FLASH 1.8V PROM | 484 |
|
$6.0375 / $10.5000 | Buy Now | ||
Quest Components | FLASH 1.8V PROM | 3 |
|
$5.1000 / $7.6500 | Buy Now |
CAD Models for S34MS04G100BHI000 by Spansion
Part Data Attributes for S34MS04G100BHI000 by Spansion
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
SPANSION INC
|
Package Description
|
BGA-63
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.1.A
|
HTS Code
|
8542.32.00.51
|
Access Time-Max
|
45 ns
|
Command User Interface
|
YES
|
Data Polling
|
NO
|
JESD-30 Code
|
R-PBGA-B63
|
Length
|
11 mm
|
Memory Density
|
4294967296 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Sectors/Size
|
4K
|
Number of Terminals
|
63
|
Number of Words
|
536870912 words
|
Number of Words Code
|
512000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
512MX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
VFBGA
|
Package Equivalence Code
|
BGA63,10X12,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Page Size
|
2K words
|
Parallel/Serial
|
PARALLEL
|
Programming Voltage
|
1.8 V
|
Qualification Status
|
Not Qualified
|
Ready/Busy
|
YES
|
Seated Height-Max
|
1 mm
|
Sector Size
|
128K
|
Standby Current-Max
|
0.000045 A
|
Supply Current-Max
|
0.02 mA
|
Supply Voltage-Max (Vsup)
|
1.95 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Toggle Bit
|
NO
|
Type
|
SLC NAND TYPE
|
Width
|
9 mm
|
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