Part Details for S34ML04G100BHV003 by Spansion
Overview of S34ML04G100BHV003 by Spansion
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for S34ML04G100BHV003
S34ML04G100BHV003 CAD Models
S34ML04G100BHV003 Part Data Attributes
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S34ML04G100BHV003
Spansion
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Datasheet
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S34ML04G100BHV003
Spansion
Flash, 512MX8, PBGA63, 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | SPANSION INC | |
Package Description | 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.51 | |
Category CO2 Kg | 12 | |
Compliance Temperature Grade | Industrial: -40C to +105C | |
Command User Interface | YES | |
Common Flash Interface | NO | |
Data Polling | NO | |
Data Retention Time-Min | 10 | |
JESD-30 Code | R-PBGA-B63 | |
Length | 11 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 63 | |
Number of Words | 536870912 words | |
Number of Words Code | 512000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA64,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 1 mm | |
Standby Current-Max | 0.00001 A | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Type | SLC NAND TYPE | |
Width | 9 mm |