Part Details for S34ML01G100BHI000 by Cypress Semiconductor
Results Overview of S34ML01G100BHI000 by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
S34ML01G100BHI000 Information
S34ML01G100BHI000 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S34ML01G100BHI000
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | AVAILABLE EU | 794 |
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Chip 1 Exchange | INSTOCK | 4 |
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Flip Electronics | Stock | 63197 |
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RFQ |
Part Details for S34ML01G100BHI000
S34ML01G100BHI000 CAD Models
S34ML01G100BHI000 Part Data Attributes
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S34ML01G100BHI000
Cypress Semiconductor
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Datasheet
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Compare Parts:
S34ML01G100BHI000
Cypress Semiconductor
Flash, 128MX8, 25ns, PBGA63, BGA-63
Select a part to compare: |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | BGA-63 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 25 ns | |
| Command User Interface | YES | |
| Common Flash Interface | NO | |
| Data Polling | NO | |
| Data Retention Time-Min | 10 | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 1K | |
| Number of Terminals | 63 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Page Size | 2K words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3.3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | NO | |
| Type | SLC NAND TYPE | |
| Width | 9 mm |