Part Details for S29JL064H55BFI000 by AMD
Overview of S29JL064H55BFI000 by AMD
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Part Details for S29JL064H55BFI000
S29JL064H55BFI000 CAD Models
S29JL064H55BFI000 Part Data Attributes
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S29JL064H55BFI000
AMD
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Datasheet
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S29JL064H55BFI000
AMD
Flash, 4MX16, 55ns, PBGA63,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA, BGA63,8X12,32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 55 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM/TOP | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B63 | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Sectors/Size | 16,126 | |
| Number of Terminals | 63 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA63,8X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Sector Size | 8K,64K | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.045 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | YES | |
| Type | NOR TYPE |