Part Details for S29GL512T11FHIV23 by Infineon Technologies AG
Overview of S29GL512T11FHIV23 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL512T11FHIV23
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S29GL512T11FHIV23TR-ND
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DigiKey | IC FLASH 512MBIT PARALLEL 64FBGA Min Qty: 1600 Lead time: 8 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$7.4023 | Buy Now |
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DISTI #
S29GL512T11FHIV23
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Avnet Americas | NOR Flash 512Mbit 32M X 16Bit/64M X 8Bit Parallel 110ns 64-Pin FBGA - Tape and Reel (Alt: S29GL512T11FHIV23) RoHS: Compliant Min Qty: 1600 Package Multiple: 1600 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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$7.4365 | Buy Now |
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DISTI #
727-S29GL512T11FHV23
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Mouser Electronics | NOR Flash Nor RoHS: Compliant | 0 |
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$7.8800 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1600 Package Multiple: 1600 Lead time: 8 Weeks | 0 |
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$6.6900 | Buy Now |
Part Details for S29GL512T11FHIV23
S29GL512T11FHIV23 CAD Models
S29GL512T11FHIV23 Part Data Attributes
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S29GL512T11FHIV23
Infineon Technologies AG
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Datasheet
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S29GL512T11FHIV23
Infineon Technologies AG
Flash, 32MX16, 110ns, PBGA64,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Access Time-Max | 110 ns | |
| Alternate Memory Width | 8 | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 11 mm |