Part Details for S29GL512T11DHV013 by Infineon Technologies AG
Overview of S29GL512T11DHV013 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL512T11DHV013
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
47AC6204
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Newark | Nor/Reel Rohs Compliant: Yes |Infineon S29GL512T11DHV013 Min Qty: 2200 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
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DISTI #
448-S29GL512T11DHV013TR-ND
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DigiKey | IC FLASH 512MBIT PARALLEL 64FBGA Min Qty: 2200 Lead time: 8 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$7.7619 | Buy Now |
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DISTI #
727-S29GL512T11DV013
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Mouser Electronics | NOR Flash IC 512 Mb FLASHMEM RoHS: Compliant | 0 |
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$7.5300 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2200 Package Multiple: 2200 Lead time: 8 Weeks Container: Reel | 0Reel |
|
$7.2800 | Buy Now |
Part Details for S29GL512T11DHV013
S29GL512T11DHV013 CAD Models
S29GL512T11DHV013 Part Data Attributes
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S29GL512T11DHV013
Infineon Technologies AG
Buy Now
Datasheet
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S29GL512T11DHV013
Infineon Technologies AG
Flash, 32MX16, 110ns, PBGA64,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Access Time-Max | 110 ns | |
| Alternate Memory Width | 8 | |
| JESD-30 Code | S-PBGA-B64 | |
| Length | 9 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |