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Memory / Flash Memories / S29GL512S12DHE010
Datasheets
S29GL512S12DHE010 by:
Infineon Technologies AG
Cypress Semiconductor
Infineon Technologies AG
Not Found

Flash, 32MX16, 120ns, PBGA64, FBGA-64

Part Details for S29GL512S12DHE010 by Infineon Technologies AG

Results Overview of S29GL512S12DHE010 by Infineon Technologies AG

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S29GL512S12DHE010 Information

S29GL512S12DHE010 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for S29GL512S12DHE010

Part # Distributor Description Stock Price Buy
DISTI # 448-S29GL512S12DHE010-ND
DigiKey IC FLASH 512MBIT CFI 64FBGA Min Qty: 520 Lead time: 8 Weeks Container: Tray Temporarily Out of Stock
  • 520 $46.2002
$46.2002 Buy Now
DISTI # S29GL512S12DHE010
Avnet Americas NOR Flash 512Mbit 32M X 16bit Parallel 3V 120ns 64-Pin FBGA Tray - Trays (Alt: S29GL512S12DHE010) RoHS: Compliant Min Qty: 8 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray 383 Partner Stock
RFQ
DISTI # S29GL512S12DHE010
Avnet Americas NOR Flash 512Mbit 32M X 16bit Parallel 3V 120ns 64-Pin FBGA Tray - Trays (Alt: S29GL512S12DHE010) RoHS: Compliant Min Qty: 520 Package Multiple: 520 Lead time: 8 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # 727-29GL512S12DHE010
Mouser Electronics NOR Flash A&D RoHS: Compliant 431
  • 1 $57.7400
  • 10 $53.5600
  • 25 $51.6400
  • 50 $50.3600
  • 100 $44.1300
$44.1300 / $57.7400 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 520 Package Multiple: 520 Lead time: 8 Weeks Container: Tray 0
Tray
  • 520 $40.8200
$40.8200 Buy Now

Part Details for S29GL512S12DHE010

S29GL512S12DHE010 CAD Models

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S29GL512S12DHE010 Part Data Attributes

Parametric Data
S29GL512S12DHE010 Infineon Technologies AG
Buy Now Datasheet
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S29GL512S12DHE010 Infineon Technologies AG Flash, 32MX16, 120ns, PBGA64, FBGA-64
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description FBGA-64
Reach Compliance Code compliant
Factory Lead Time 2 Days
Samacsys Manufacturer Infineon
Access Time-Max 120 ns
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Data Retention Time-Min 20
Endurance 100 Write/Erase Cycles
JESD-30 Code S-PBGA-B64
Length 9 mm
Memory Density 536870912 bit
Memory IC Type FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 512
Number of Terminals 64
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA64,8X8,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Page Size 16 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Ready/Busy YES
Seated Height-Max 1.4 mm
Sector Size 64K
Standby Current-Max 0.0002 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Toggle Bit YES
Type NOR TYPE
Width 9 mm
Write Cycle Time-Max (tWC) 0.00006 ms

S29GL512S12DHE010 Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the S29GL512S12DHE010 is -40°C to +85°C.

  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation. During this time, the device will tri-state its outputs and ignore any input signals.

  • The WP# pin is used to prevent accidental writes to the device. When WP# is low, the device is in write-protect mode, and any write operations will be ignored.

  • To perform a sector erase operation, send the erase command (0x60h) followed by the sector address. The device will then erase the entire sector.

  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal. This ensures proper device initialization.