Part Details for S29GL512S11DHA020 by Cypress Semiconductor
Overview of S29GL512S11DHA020 by Cypress Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL512S11DHA020
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
51Y2090
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Newark | Nor/Tray |Cypress Infineon Technologies S29GL512S11DHA020 Min Qty: 2600 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
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DISTI #
2832-S29GL512S11DHA020-ND
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DigiKey | IC FLASH 512MBIT PARALLEL 64FBGA Min Qty: 100 Lead time: 1 Weeks Container: Tray MARKETPLACE PRODUCT |
7134 In Stock |
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$7.6200 | Buy Now |
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Rochester Electronics | S29GL512S - 512-Mbit (64 Mbyte), 3.0V, GL-S Flash Memory RoHS: Compliant Status: Active Min Qty: 1 | 6386 |
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$7.4500 / $8.7600 | Buy Now |
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Flip Electronics | Stock, ship today | 15654 |
|
$5.7100 | RFQ |
Part Details for S29GL512S11DHA020
S29GL512S11DHA020 CAD Models
S29GL512S11DHA020 Part Data Attributes:
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S29GL512S11DHA020
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
S29GL512S11DHA020
Cypress Semiconductor
Flash, 64MX8, PBGA64, FBGA-64
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-64 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Date Of Intro | 2016-11-30 | |
| Access Time-Max | 110 ns | |
| Boot Block | BOTTOM/TOP | |
| JESD-30 Code | S-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 9 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 1.4 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | NOR TYPE | |
| Width | 9 mm |