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Overview of S29GL512N10FAI010 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for S29GL512N10FAI010 by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
S29GL512N10FAI010
|
Avnet Americas | NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 100ns 64-Pin Fortified BGA Tray - Trays (Alt: S29GL512N10FAI010) RoHS: Not Compliant Min Qty: 58 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 4980 Partner Stock |
|
$10.7260 / $12.9750 | Buy Now |
CAD Models for S29GL512N10FAI010 by Infineon Technologies AG
Part Data Attributes for S29GL512N10FAI010 by Infineon Technologies AG
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
2 Days
|
Access Time-Max
|
100 ns
|
Alternate Memory Width
|
8
|
Clock Frequency-Max (fCLK)
|
10 MHz
|
Command User Interface
|
YES
|
Common Flash Interface
|
YES
|
Data Polling
|
YES
|
Data Retention Time-Min
|
20
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
R-PBGA-B64
|
JESD-609 Code
|
e0
|
Length
|
13 mm
|
Memory Density
|
536870912 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
16
|
Number of Functions
|
1
|
Number of Sectors/Size
|
512
|
Number of Terminals
|
64
|
Number of Words
|
33554432 words
|
Number of Words Code
|
32000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
32MX16
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA64,8X8,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL/SERIAL
|
Programming Voltage
|
3 V
|
Ready/Busy
|
YES
|
Seated Height-Max
|
1.4 mm
|
Sector Size
|
128K
|
Standby Current-Max
|
0.000005 A
|
Supply Current-Max
|
0.09 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Toggle Bit
|
YES
|
Type
|
NOR TYPE
|
Width
|
11 mm
|