Part Details for S29GL256N10FFI010 by AMD
Overview of S29GL256N10FFI010 by AMD
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for S29GL256N10FFI010
S29GL256N10FFI010 CAD Models
S29GL256N10FFI010 Part Data Attributes
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S29GL256N10FFI010
AMD
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Datasheet
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S29GL256N10FFI010
AMD
Flash, 16MX16, 100ns, PBGA64,
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 100 ns | |
Alternate Memory Width | 8 | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
JESD-30 Code | S-PBGA-B64 | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Sectors/Size | 256 | |
Number of Terminals | 64 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA64,8X8,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Page Size | 8/16 words | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Sector Size | 128K | |
Standby Current-Max | 0.000005 A | |
Supply Current-Max | 0.09 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Toggle Bit | YES | |
Type | NOR TYPE |