Part Details for S29GL128S11FHVV20 by Infineon Technologies AG
Overview of S29GL128S11FHVV20 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL128S11FHVV20
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S29GL128S11FHVV20-ND
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DigiKey | IC FLASH 128MBIT CFI 64FBGA Min Qty: 1800 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$4.1730 | Buy Now |
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DISTI #
727-29GL128S11FHVV20
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Mouser Electronics | NOR Flash PNOR RoHS: Compliant | 0 |
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$4.1400 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1800 Package Multiple: 1800 Lead time: 8 Weeks | 0 |
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$3.6500 | Buy Now |
Part Details for S29GL128S11FHVV20
S29GL128S11FHVV20 CAD Models
S29GL128S11FHVV20 Part Data Attributes
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S29GL128S11FHVV20
Infineon Technologies AG
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Datasheet
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S29GL128S11FHVV20
Infineon Technologies AG
Flash, 16MX8, 110ns, PBGA64,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Access Time-Max | 110 ns | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 128 | |
| Number of Terminals | 64 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Page Size | 16 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.4 mm | |
| Sector Size | 64K | |
| Standby Current-Max | 0.0002 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 11 mm |