Part Details for S29GL01GT11TFV010 by Infineon Technologies AG
Overview of S29GL01GT11TFV010 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL01GT11TFV010
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
S29GL01GT11TFV010-ND
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DigiKey | IC FLASH 1GBIT PARALLEL 56TSOP Min Qty: 910 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$11.6643 | Buy Now |
DISTI #
S29GL01GT11TFV010
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Avnet Americas | NOR Flash 1Gb 64M X 16Bit/128M X 8Bit Parallel 110ns 56-Pin TSOP - Trays (Alt: S29GL01GT11TFV010) RoHS: Compliant Min Qty: 56 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 80 Partner Stock |
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$11.1600 / $13.5000 | Buy Now |
DISTI #
727-S29GL01GT11TFV01
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Mouser Electronics | NOR Flash NOR RoHS: Compliant | 0 |
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$11.0600 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 910 Package Multiple: 910 Lead time: 8 Weeks | 0 |
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$10.4800 | Buy Now |
Part Details for S29GL01GT11TFV010
S29GL01GT11TFV010 CAD Models
S29GL01GT11TFV010 Part Data Attributes
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S29GL01GT11TFV010
Infineon Technologies AG
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Datasheet
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S29GL01GT11TFV010
Infineon Technologies AG
Flash, 64MX16, 110ns, PDSO56,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 110 ns | |
JESD-30 Code | R-PDSO-G56 | |
JESD-609 Code | e3 | |
Length | 18.4 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 56 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 2.7 V | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |