Datasheets
S29AL016J55BFIR22 by:

Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48

Part Details for S29AL016J55BFIR22 by Spansion

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Part Details for S29AL016J55BFIR22

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S29AL016J55BFIR22 Part Data Attributes

S29AL016J55BFIR22 Spansion
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S29AL016J55BFIR22 Spansion Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer SPANSION INC
Part Package Code BGA
Package Description 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
Pin Count 48
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 55 ns
Additional Feature BOTTOM BOOT BLOCK
Alternate Memory Width 8
Boot Block BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B48
JESD-609 Code e1
Length 8.15 mm
Memory Density 16777216 bit
Memory IC Type FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 1,2,1,31
Number of Terminals 48
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES
Type NOR TYPE
Width 6.15 mm

Alternate Parts for S29AL016J55BFIR22

This table gives cross-reference parts and alternative options found for S29AL016J55BFIR22. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29AL016J55BFIR22, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
S29AL016J55BFNR22 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFNR22
S29AL016J55BFIR23 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFIR23
S29AL016J55BFNR23 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFNR23
S29AL016J55BFIR20 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFIR20
S29AL016J55BFIR12 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFIR12
S29AL016J55BFNR13 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFNR13
S29AL016J55BFNR20 Flash, 1MX16, 55ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 Spansion S29AL016J55BFIR22 vs S29AL016J55BFNR20
Part Number Description Manufacturer Compare
24AA08-E/MC 1K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 Microchip Technology Inc S29AL016J55BFIR22 vs 24AA08-E/MC
24LC16BI/SL 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.150 INCH, PLASTIC, SOIC-14 Microchip Technology Inc S29AL016J55BFIR22 vs 24LC16BI/SL
24LC32AT-I/SN 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 Microchip Technology Inc S29AL016J55BFIR22 vs 24LC32AT-I/SN
CAT64LC40YRA-TE13 256X16 SPI BUS SERIAL EEPROM, PDSO8, LEAD AND HALOGEN FREE, TSSOP-8 Catalyst Semiconductor S29AL016J55BFIR22 vs CAT64LC40YRA-TE13
24C16B-E/P 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 Microchip Technology Inc S29AL016J55BFIR22 vs 24C16B-E/P
AM29LV160DT-90WCD 1MX16 FLASH 3V PROM, 90ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 Spansion S29AL016J55BFIR22 vs AM29LV160DT-90WCD
M24C01-WDW1T 128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8 STMicroelectronics S29AL016J55BFIR22 vs M24C01-WDW1T
93LCS66-I/SM 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 Microchip Technology Inc S29AL016J55BFIR22 vs 93LCS66-I/SM
M24C04-DW1T 512X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8 STMicroelectronics S29AL016J55BFIR22 vs M24C04-DW1T
24LC21T-I/SN 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 Microchip Technology Inc S29AL016J55BFIR22 vs 24LC21T-I/SN

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