Part Details for S26HS512TGABHV000 by Cypress Semiconductor
Results Overview of S26HS512TGABHV000 by Cypress Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
S26HS512TGABHV000 Information
S26HS512TGABHV000 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S26HS512TGABHV000
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 676 |
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RFQ |
Part Details for S26HS512TGABHV000
S26HS512TGABHV000 CAD Models
S26HS512TGABHV000 Part Data Attributes
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S26HS512TGABHV000
Cypress Semiconductor
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Datasheet
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | BGA-24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| Data Retention Time-Min | 25 | |
| Endurance | 1280000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | OPEN-DRAIN | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 1 mm | |
| Serial Bus Type | SPI | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE |