There are no models available for this part yet.
Overview of S25FL512SDSBHBC10 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S25FL512SDSBHBC10 by Infineon Technologies AG
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
448-S25FL512SDSBHBC10-ND
|
DigiKey | IC FLASH 512MBIT SPI/QUAD 24BGA Min Qty: 3380 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
|
$8.0006 | Buy Now | |
|
DISTI #
727-S25FL512SDSBBC10
|
Mouser Electronics | NOR Flash Nor RoHS: Compliant | 0 |
|
$7.6500 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 3380 Package Multiple: 3380 Lead time: 8 Weeks | 0 |
|
$7.5700 | Buy Now | ||
|
DISTI #
SP005661953
|
EBV Elektronik | (Alt: SP005661953) RoHS: Compliant Min Qty: 3380 Package Multiple: 3380 Lead time: 9 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for S25FL512SDSBHBC10 by Infineon Technologies AG
Part Data Attributes for S25FL512SDSBHBC10 by Infineon Technologies AG
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
|
Package Description
|
BGA-24
|
|
Reach Compliance Code
|
compliant
|
|
Additional Feature
|
ITS ALSO CONFIGURABLE AS 512MX1
|
|
Alternate Memory Width
|
4
|
|
Clock Frequency-Max (fCLK)
|
80 MHz
|
|
Data Retention Time-Min
|
20
|
|
Endurance
|
100000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-PBGA-B24
|
|
JESD-609 Code
|
e1
|
|
Length
|
8 mm
|
|
Memory Density
|
512753664 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
8
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
24
|
|
Number of Words
|
64094208 words
|
|
Number of Words Code
|
64000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
105 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
64MX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TBGA
|
|
Package Equivalence Code
|
BGA24,5X5,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial
|
SERIAL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Programming Voltage
|
3 V
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
1.2 mm
|
|
Serial Bus Type
|
SPI
|
|
Standby Current-Max
|
0.0003 A
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Type
|
NOR TYPE
|
|
Width
|
6 mm
|
|
Write Protection
|
HARDWARE/SOFTWARE
|
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