There are no models available for this part yet.
Overview of S25FL512SAGMFAR11 by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S25FL512SAGMFAR11 by Cypress Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Flip Electronics | Stock | 10008 |
|
RFQ |
CAD Models for S25FL512SAGMFAR11 by Cypress Semiconductor
Part Data Attributes for S25FL512SAGMFAR11 by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description
|
SOP, SOP16,.4
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Clock Frequency-Max (fCLK)
|
133 MHz
|
Data Retention Time-Min
|
20
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
R-PDSO-G16
|
JESD-609 Code
|
e3
|
Length
|
10.3 mm
|
Memory Density
|
512753664 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
16
|
Number of Words
|
64094208 words
|
Number of Words Code
|
64000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
64MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
SOP
|
Package Equivalence Code
|
SOP16,.4
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE
|
Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
260
|
Programming Voltage
|
3 V
|
Screening Level
|
AEC-Q100
|
Seated Height-Max
|
2.65 mm
|
Serial Bus Type
|
SPI
|
Supply Current-Max
|
0.1 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
MATTE TIN
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Type
|
NOR TYPE
|
Width
|
7.5 mm
|
Write Protection
|
HARDWARE/SOFTWARE
|