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Overview of S25FL256SAGBHBC13 by Cypress Semiconductor
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- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for S25FL256SAGBHBC13 by Cypress Semiconductor
Part Data Attributes for S25FL256SAGBHBC13 by Cypress Semiconductor
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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CYPRESS SEMICONDUCTOR CORP
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Package Description
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TBGA,
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.51
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Additional Feature
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ALSO CONFIGURABLE AS 256M X 1
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Alternate Memory Width
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2
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Clock Frequency-Max (fCLK)
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133 MHz
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JESD-30 Code
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R-PBGA-B24
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Length
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8 mm
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Memory Density
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268435456 bit
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Memory IC Type
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FLASH
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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24
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Number of Words
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33554432 words
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Number of Words Code
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32000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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105 °C
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Operating Temperature-Min
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-40 °C
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Organization
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32MX8
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TBGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE
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Parallel/Serial
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SERIAL
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Programming Voltage
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3 V
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Screening Level
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AEC-Q100
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Seated Height-Max
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1.2 mm
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Supply Current-Max
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0.1 mA
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Supply Voltage-Max (Vsup)
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3.6 V
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Supply Voltage-Min (Vsup)
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2.7 V
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Supply Voltage-Nom (Vsup)
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3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Type
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NOR TYPE
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Width
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6 mm
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Write Cycle Time-Max (tWC)
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500 ms
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