Part Details for S25FL001D0FMAI003 by Spansion
Overview of S25FL001D0FMAI003 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for S25FL001D0FMAI003
S25FL001D0FMAI003 CAD Models
S25FL001D0FMAI003 Part Data Attributes
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S25FL001D0FMAI003
Spansion
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Datasheet
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S25FL001D0FMAI003
Spansion
EEPROM, 1MX1, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SO-8
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP8,.25 | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 25 MHz | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G8 | |
| Length | 4.8895 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7526 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.000003 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 3.8989 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S25FL001D0FMAI003
This table gives cross-reference parts and alternative options found for S25FL001D0FMAI003. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FL001D0FMAI003, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25X10LZPCG | Flash, 1MX1, 6 X 5 MM, GREEN, WSON-8 | Winbond Electronics Corp | S25FL001D0FMAI003 vs W25X10LZPCG |
| W25X10LZPIZ | Flash, 1MX1, 6 X 5 MM, ROHS COMPLIANT, WSON-8 | Winbond Electronics Corp | S25FL001D0FMAI003 vs W25X10LZPIZ |
| MX25L1005ZMI-12G | Flash, 1MX1, 6 X 5 MM, 1 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, MO-220, SON-8 | Macronix International Co Ltd | S25FL001D0FMAI003 vs MX25L1005ZMI-12G |
| W25X10VZPC | Flash, 1MX1, 6 X 5 MM, WSON-8 | Winbond Electronics Corp | S25FL001D0FMAI003 vs W25X10VZPC |
| W25X10LDACZ | Flash, 1MX1, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | Winbond Electronics Corp | S25FL001D0FMAI003 vs W25X10LDACZ |
| SST25VF010-20-4C-QAE-DD029 | 1M X 1 SPI BUS SERIAL EEPROM, DSO8, WSON-8 | Microchip Technology Inc | S25FL001D0FMAI003 vs SST25VF010-20-4C-QAE-DD029 |
| F25L01PA-100PG2D | Flash, 1MX1, PDSO8, 0.150 INCH, 1.27 MM PITCH, ROHS COMPLIANT, SOIC-8 | Elite Semiconductor Memory Technology Inc | S25FL001D0FMAI003 vs F25L01PA-100PG2D |
| W25X10VDACZ | Flash, 1MX1, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | Winbond Electronics Corp | S25FL001D0FMAI003 vs W25X10VDACZ |
| AT45DB011D-MH-T | Flash, 1MX1, PDSO8, 6 X 5 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8 | Adesto Technologies Corporation | S25FL001D0FMAI003 vs AT45DB011D-MH-T |
| SST25VF010-20-4C-SAE-DD029 | 1M X 1 SPI BUS SERIAL EEPROM, PDSO8, 4.90 X 6 MM, MS-012AA, SOIC-8 | Microchip Technology Inc | S25FL001D0FMAI003 vs SST25VF010-20-4C-SAE-DD029 |