Part Details for S1C33209F00A by Epson Electronics America Inc
Overview of S1C33209F00A by Epson Electronics America Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Healthcare
Telecommunications
Part Details for S1C33209F00A
S1C33209F00A CAD Models
S1C33209F00A Part Data Attributes:
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S1C33209F00A
Epson Electronics America Inc
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Datasheet
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S1C33209F00A
Epson Electronics America Inc
32-BIT, 60MHz, RISC MICROCONTROLLER, PQFP128, PLASTIC, QFP5-128
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| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | SEIKO EPSON CORP | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 128 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Additional Feature | ALSO AVAILABLE AS CHIP PACKAGE | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 33 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | R-PQFP-G128 | |
| Length | 20 mm | |
| Number of I/O Lines | 42 | |
| Number of Terminals | 128 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3 mm | |
| Speed | 60 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |