Datasheets
RY7011A0000DZ00#002 by: Renesas Electronics Corporation

Bluetooth® Low Energy Microcontrollers for Smart Connectivity, , /

Part Details for RY7011A0000DZ00#002 by Renesas Electronics Corporation

Results Overview of RY7011A0000DZ00#002 by Renesas Electronics Corporation

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Applications Industrial Automation Renewable Energy Robotics and Drones

RY7011A0000DZ00#002 Information

RY7011A0000DZ00#002 by Renesas Electronics Corporation is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for RY7011A0000DZ00#002

Part # Distributor Description Stock Price Buy
DISTI # 559-RY7011A0000DZ00#002CT-ND
DigiKey IC RF TXRX+MCU BLUETOOTH 42LFLGA Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 168
In Stock
  • 1 $30.4700
  • 10 $24.6410
  • 25 $23.1856
  • 100 $21.5859
$21.5859 / $30.4700 Buy Now
DISTI # RY7011A0000DZ00#002
Avnet Americas Bluetooth Module, V 4.2 LE, 2.402GHz to 2.48GHz, -15 dBm, -92dBm - Tape and Reel (Alt: RY7011A0000DZ... 00#002) more RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 12 Weeks, 0 Days Container: Reel 0
  • 1 $26.9440
$26.9440 Buy Now
DISTI # 968-7011A0000DZ00002
Mouser Electronics Bluetooth Modules - 802.15.1 RL78 BLE MODULE 256K/20K 42PIN -25/+75C RoHS: Compliant 0
  • 1 $26.5300
  • 10 $24.4900
  • 20 $22.4400
  • 100 $20.7400
  • 200 $19.7200
$19.7200 / $26.5300 Order Now
Future Electronics RL78 Series 256K/20K 42 Pin -25 to +75 C BLE Module RoHS: Compliant pbFree: Yes Min Qty: 100 Package Multiple: 100 Lead time: 12 Weeks Container: Reel 0
Reel
  • 100 $16.0000
  • 200 $15.8500
$15.8500 / $16.0000 Buy Now
DISTI # 79931337
Verical MCU 16-bit RL78 CISC 256KB Flash 3.3V T/R Min Qty: 3 Package Multiple: 1 Date Code: 2304 Americas - 170
  • 3 $23.3000
$23.3000 Buy Now
DISTI # RY7011A0000DZ00#002
Chip One Stop Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Cut Tape 170
  • 1 $23.3000
  • 5 $18.9000
  • 10 $17.6000
  • 50 $15.2000
  • 100 $14.5000
  • 200 $13.7000
$13.7000 / $23.3000 Buy Now

Part Details for RY7011A0000DZ00#002

RY7011A0000DZ00#002 CAD Models

RY7011A0000DZ00#002 Part Data Attributes

RY7011A0000DZ00#002 Renesas Electronics Corporation
Buy Now Datasheet
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RY7011A0000DZ00#002 Renesas Electronics Corporation Bluetooth® Low Energy Microcontrollers for Smart Connectivity, , /
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer RENESAS ELECTRONICS CORP
Package Description LGA-42
Manufacturer Package Code MLZZ0042ZA
Reach Compliance Code compliant
Factory Lead Time 12 Weeks
Samacsys Manufacturer Renesas Electronics
JESD-30 Code R-XBGA-B42
Length 13.35 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 42
Operating Temperature-Max 75 °C
Operating Temperature-Min -25 °C
Package Body Material UNSPECIFIED
Package Code LLGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Seated Height-Max 1.7 mm
Supply Voltage-Nom 3 V
Surface Mount YES
Telecom IC Type TELECOM CIRCUIT
Temperature Grade COMMERCIAL EXTENDED
Terminal Form BUTT
Terminal Pitch 0.85 mm
Terminal Position BOTTOM
Width 8.95 mm

RY7011A0000DZ00#002 Related Parts

RY7011A0000DZ00#002 Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.

  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the recommended temperature range (–40°C to 125°C) and consider derating the device for high-temperature applications.

  • Use a minimum of 10uF ceramic capacitors with a voltage rating of 10V or higher, placed as close as possible to the device's power pins. Additional capacitors can be added in parallel to reduce impedance and improve noise filtering.

  • Implement ESD protection using TVS diodes or ESD arrays on the input/output lines. Ensure the protection devices are rated for the maximum voltage and current of the application. Follow the manufacturer's guidelines for ESD protection circuit design.

  • Follow the manufacturer's recommended soldering and rework conditions: peak temperature 260°C, time above 217°C 30s, and 3 reflow cycles maximum. Use a nitrogen atmosphere and ensure the device is not exposed to temperatures above 260°C.