Datasheets
RJK2009DPM-00#T0 by: Renesas Electronics Corporation

Nch Single Power Mosfet 200V 40A 36Mohm To-3Pfm, TO-3PFM, /Tube

Part Details for RJK2009DPM-00#T0 by Renesas Electronics Corporation

Results Overview of RJK2009DPM-00#T0 by Renesas Electronics Corporation

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

RJK2009DPM-00#T0 Information

RJK2009DPM-00#T0 by Renesas Electronics Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
RJK2009DPM-00#T0 Renesas Electronics Corporation Nch Single Power Mosfet 200V 40A 36Mohm To-3Pfm

Price & Stock for RJK2009DPM-00#T0

Part # Distributor Description Stock Price Buy
DISTI # RJK2009DPM-00#T0-ND
DigiKey MOSFET N-CH 200V 40A TO3PFM Lead time: 30 Weeks Container: Tube Temporarily Out of Stock
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Part Details for RJK2009DPM-00#T0

RJK2009DPM-00#T0 CAD Models

RJK2009DPM-00#T0 Part Data Attributes

RJK2009DPM-00#T0 Renesas Electronics Corporation
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RJK2009DPM-00#T0 Renesas Electronics Corporation Nch Single Power Mosfet 200V 40A 36Mohm To-3Pfm, TO-3PFM, /Tube
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code TO-3PFM
Package Description ,
Pin Count 3
Manufacturer Package Code PRSS0003ZA
Reach Compliance Code compliant
ECCN Code 5A002
Samacsys Manufacturer Renesas Electronics
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

RJK2009DPM-00#T0 Frequently Asked Questions (FAQ)

  • Renesas provides a recommended PCB layout guide in their application note (AP61101) for the RJK2009DPM-00#T0. It suggests using a 2-layer or 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation.

  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a thermal interface material (TIM) between the device and the heat sink. Additionally, Renesas recommends derating the device's power dissipation according to the ambient temperature.

  • Renesas recommends following the JEDEC J-STD-020D.1 standard for soldering conditions. The recommended peak temperature is 260°C, with a maximum time above 217°C of 30 seconds. It's also essential to use a solder with a melting point above 217°C.

  • Renesas recommends following a controlled power-up and power-down sequence to prevent damage to the device. The power-up sequence should be: VCC, then VDD, and finally the input signals. The power-down sequence should be the reverse of the power-up sequence.

  • The built-in OCP feature in the RJK2009DPM-00#T0 is designed to protect the device from excessive current. However, it may also affect the system design, as it may trigger a shutdown or reset in the event of an overcurrent condition. Engineers should consider this feature when designing their system's fault tolerance and error handling mechanisms.