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Nch Single Power Mosfet 200V 40A 36Mohm To-3Pfm, TO-3PFM, /Tube
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RJK2009DPM-00#T0 by Renesas Electronics Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part # | Manufacturer | Description | Datasheet |
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RJK2009DPM-00#T0 | Renesas Electronics Corporation | Nch Single Power Mosfet 200V 40A 36Mohm To-3Pfm |
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
RJK2009DPM-00#T0-ND
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DigiKey | MOSFET N-CH 200V 40A TO3PFM Lead time: 30 Weeks Container: Tube | Temporarily Out of Stock |
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RJK2009DPM-00#T0
Renesas Electronics Corporation
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Datasheet
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RJK2009DPM-00#T0
Renesas Electronics Corporation
Nch Single Power Mosfet 200V 40A 36Mohm To-3Pfm, TO-3PFM, /Tube
Select a part to compare: |
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | TO-3PFM | |
Package Description | , | |
Pin Count | 3 | |
Manufacturer Package Code | PRSS0003ZA | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002 | |
Samacsys Manufacturer | Renesas Electronics | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Renesas provides a recommended PCB layout guide in their application note (AP61101) for the RJK2009DPM-00#T0. It suggests using a 2-layer or 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a thermal interface material (TIM) between the device and the heat sink. Additionally, Renesas recommends derating the device's power dissipation according to the ambient temperature.
Renesas recommends following the JEDEC J-STD-020D.1 standard for soldering conditions. The recommended peak temperature is 260°C, with a maximum time above 217°C of 30 seconds. It's also essential to use a solder with a melting point above 217°C.
Renesas recommends following a controlled power-up and power-down sequence to prevent damage to the device. The power-up sequence should be: VCC, then VDD, and finally the input signals. The power-down sequence should be the reverse of the power-up sequence.
The built-in OCP feature in the RJK2009DPM-00#T0 is designed to protect the device from excessive current. However, it may also affect the system design, as it may trigger a shutdown or reset in the event of an overcurrent condition. Engineers should consider this feature when designing their system's fault tolerance and error handling mechanisms.