Datasheets
R5F61663MD50BGV by: Renesas Electronics Corporation

Microcontrollers with 32-bit CISC CPU for System Control Applications (Non Promotion), LFBGA, /Tray

Part Details for R5F61663MD50BGV by Renesas Electronics Corporation

Overview of R5F61663MD50BGV by Renesas Electronics Corporation

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Available Datasheets

Part # Manufacturer Description Datasheet
R5F61663MD50BGV Renesas Electronics Corporation Microcontrollers with 32-bit CISC CPU for System Control Applications (Non Promotion)

Price & Stock for R5F61663MD50BGV

Part # Distributor Description Stock Price Buy
DISTI # 559-R5F61663MD50BGV-ND
DigiKey 32-BIT GENERAL MCU Min Qty: 152 Lead time: 12 Weeks Container: Tray Temporarily Out of Stock
  • 152 $22.0555
$22.0555 Buy Now
DISTI # R5F61663MD50BGV
Avnet Americas 32-BIT GENERAL MCU - Trays (Alt: R5F61663MD50BGV) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 12 Weeks, 0 Days Container: Tray 0
  • 1 $23.4900
$23.4900 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 152 Package Multiple: 152 Lead time: 12 Weeks Container: Tray 0
Tray
  • 152 $22.0300
$22.0300 Buy Now

Part Details for R5F61663MD50BGV

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R5F61663MD50BGV Part Data Attributes

R5F61663MD50BGV Renesas Electronics Corporation
Buy Now Datasheet
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R5F61663MD50BGV Renesas Electronics Corporation Microcontrollers with 32-bit CISC CPU for System Control Applications (Non Promotion), LFBGA, /Tray
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code LFBGA
Package Description LFBGA, BGA176,15X15,32
Pin Count 176
Manufacturer Package Code PLBG0176GA
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 12 Weeks
Samacsys Manufacturer Renesas Electronics
Has ADC YES
Address Bus Width 24
Bit Size 32
CPU Family H8SX
Clock Frequency-Max 50 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width 16
JESD-30 Code S-PBGA-B176
Length 13 mm
Number of I/O Lines 101
Number of Terminals 176
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA176,15X15,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
RAM (bytes) 40960
ROM (words) 393216
ROM Programmability FLASH
Seated Height-Max 1.4 mm
Speed 50 MHz
Supply Current-Max 125 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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